RE900 - Multiadaptor, Smd, Fr4, Tsop I/Ii

Multiadaptor, Smd, Fr4, Tsop I/Ii; Convert From:-; Convert To:-; Pitch Spacing:2.54Mm; Row Pitch:-; Product Range:-; Svhc:No Svhc (15-Jan-2019); Board Connector / Footprint:Tsop-1 & Tsop-2; Board Material:Epoxy Glass Composite; Board Thickness:1.5Mm; Board Type:Smd Device Adapter; Copper Coating Density:Chem. Au 0.08 - 0.1 Μm; Copper Thickness:35Μm; External Height:72.2Mm; External Length / Height:72.2Mm; External Width:76.2Mm; Hole Diameter:1Mm; Hole Pitch:2.54Mm; Material:Epoxied Fr4; No. Of Copper Coated Sides:2; Pcb Size:72.60 X 72.20 Mm; Pad Area:1.50 Mm Ø; Pad Diameter:1.5Mm