RE933-01 - Adaptor, Smd, Tssop-8, 0.65Mm

Adaptor, Smd, Tssop-8, 0.65Mm; Convert From:-; Convert To:-; Pitch Spacing:2.54Mm; Row Pitch:2.54Mm; Product Range:-; Svhc:No Svhc (15-Jan-2019); Board Connector / Footprint:Tssop-8; Board Material:Epoxy Glass Composite; Board Thickness:1.5Mm; Board Type:Smd Device Adapter; Copper Coating Density:Chem. Au 0.08 - 0.1 Μm; Copper Thickness:35Μm; External Height:9Mm; External Length / Height:9Mm; External Width:23.5Mm; Hole Diameter:1Mm; Hole Pitch:2.54Mm; Material:Epoxied Fr4; No. Of Copper Coated Sides:2; No. Of Holes:8; Pcb Size:9 X 23.5 Mm; Pad Diameter:1.5Mm