RE933-10 - Adaptor, Smd, Tssop-56, 0.50Mm

Adaptor, Smd, Tssop-56, 0.50Mm; Convert From:-; Convert To:-; Pitch Spacing:2.54Mm; Row Pitch:2.54Mm; Product Range:-; Svhc:No Svhc (15-Jan-2019); Board Connector / Footprint:Tssop-56; Board Material:Epoxy Glass Composite; Board Thickness:1.5Mm; Board Type:Smd Device Adapter; Copper Coating Density:Chem. Au 0.08 - 0.1 Μm; Copper Thickness:35Μm; External Height:27Mm; External Length / Height:27Mm; External Width:39.5Mm; Hole Diameter:1Mm; Hole Pitch:2.54Mm; Material:Epoxied Fr4; No. Of Copper Coated Sides:2; No. Of Holes:56; Pcb Size:27.0 X 39,5 Mm; Pad Diameter:1.5Mm