K10-104 - THERMAL PAD, TO-3P

THERMAL PAD, TO-3P; Insulator Body Material:PI (Polyimide) Film; Thermal Conductivity:1.3W/m.K; Breakdown Voltage Vbr:6kV; Thickness:0.152mm; Volume Resistivity:10ohm-m; Thermal Impedance:0.86°C/W; Dielectric Strength:-; Product Range:-; SVHC:No SVHC (27-Jun-2018); Electrical Property Ins / Con:Insulative; External Depth:0.15mm; Isolation Voltage:6kV; Operating Temperature Max:180°C; Operating Temperature Min:-60°C; Packages Cooled:TO-3P; Thermal Resistance:0.2°C/W; Type:Thermal Pad